【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Robustnessofterminations(leadintegrity)
【原文标准名称】:半导体器件.机械和气候试验方法.端子的耐久性
【标准号】:BSEN60749-14-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-12-15
【实施或试行日期】:2003-12-15
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:ThispartofIEC60749providesvarioustestsfordeterminingtheintegritybetweenthelead/packageinterfaceandtheleaditselfwhenthelead(s)arebentduetofaultyboardassemblyfollowedbyreworkofthepartforre-assembly.Forhermeticpackages,itisrecommendedthatthistestbefollowedbyhermeticitytestsinaccordancewithIEC60749-8todetermineifthereareanyadverseeffectsfromthestressesappliedtothesealsaswellastotheleads.Thistest,includingeachofthetestconditions,isconsidereddestructiveandisonlyrecommendedforqualificationtesting.Thisstandardisapplicabletoallthrough-holedevicesandsurface-mountdevicesrequiringleadformingbytheuser.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:18P;A4
【正文语种】:英语